End-to-end mechanical analysis support for aerospace, defense, and high-reliability electronics programs.
We perform response analysis of avionics enclosures, PCBs, and mechanical assemblies subjected to random vibration environments per MIL-STD-810 and RTCA DO-160.
Methods: Steinberg, Miles Equation, FEA modal analysis
Steady-state and transient thermal modeling of electronics enclosures, heat sinks, and component layouts to ensure junction temperature compliance.
Tools: ANSYS Mechanical, hand calculations, thermal resistance models
Static and dynamic structural analysis of mounting brackets, chassis, enclosures, and mechanical interfaces. We optimize designs for weight and manufacturability.
Deliverables: Stress reports, engineering drawings with GD&T, load tables
Dynamic analysis of printed circuit boards and circuit card assemblies to verify component survivability under vibration and shock environments.
Standards: IPC-2221, Steinberg methodology, customer SCD requirements
We review your SOW, environmental specs, and system requirements to define the analysis scope.
FEA models built in ANSYS/Nastran. Hand calculations validate critical results.
Formal analysis report with margin summaries, plots, and recommendations delivered for design review.
Iterate on design changes, re-run analysis, and support qualification through test correlation.
We're ready to support your next analysis effort. Reach out for a free consultation.
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