End-to-end engineering for aerospace and defense — from structural and thermal analysis to product design and turnkey hardware delivery. MIL-STD qualified. SAM.gov registered.
Full-spectrum mechanical engineering analysis for aerospace, defense, and high-reliability electronics programs.
MIL-STD-810 and Steinberg methodology for avionics enclosures and component qualification. Fatigue life and margin-of-safety assessment.
Steady-state and transient thermal modeling. Junction temperature prediction, heat sink optimization, and conduction/convection path analysis.
Linear and nonlinear static analysis of brackets, chassis, and enclosures. Load path verification, stress analysis, and design optimization.
Natural frequency prediction, Steinberg deflection criteria, and component-level risk assessment for circuit card assemblies under dynamic environments.
Mechanical design of avionics LRUs, card cages, and connector panel assemblies. EMI/EMC shielding considerations and producibility review.
Analysis reports per customer and MIL-STD templates. Drawing packages with GD&T callouts. Design review support documentation.
Fictional demonstration analyses showcasing our methodology and deliverables.
Load comparison across L-bracket, gusset, and U-channel configurations with engineering drawings and margin of safety tables.
View Study →MIL-STD-810 random vibration response analysis with PSD curves, transmissibility, and component fatigue assessment.
Coming SoonSteady-state thermal analysis showing junction temperatures, thermal resistance paths, and heat dissipation assessment.
Coming SoonLet's discuss your analysis and design requirements. We deliver MIL-STD compliant analysis packages on schedule and on budget.
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